Thermal interface material
  1. Bergquist
  2. 11
  3. Sil-Pad系列
  4. Bond-Ply系列
  5. Hi-Plow系列
  6. Gap-Pad系列
  7. Liqui-Bond系列
Sealant Material
  1. Gore
  2. Garlock
  3. Saint-Gobin
Industrial Electronic accessories
  1. Solder Paste
  2. LOCTITE adhesive
  3. Coatings
  4. Microcare
  5. Thermal silicon grease

HF212

Recognizing the unique requirements of larger
printed circuit boards (PCBs) used for many
industrial and automotive applications,
Henkel’s LOCTITE® HF 212, formerly known as
LOCTITE® MULTICORE HF 212, has designed a
halogen-free solder paste that withstands the
thermal demands inherent with larger assemblies.
High reliability and a wide reflow process window
are at the foundation of this material, ensuring
its outstanding performance for the most
demanding high value PCB applications – all in a
halogen-free formula

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