PRODUCT DESCRIPTION
LOCTITE GC 10 provides the following product characteristics:
Technology No-clean and Halogen-free Solder Paste
Application Pb-free soldering
LOCTITE GC 10 solder paste is a halogen free, no-clean, low voiding,
Pb-free solder paste specially formulated to provide added long term
stability over a range of temperature conditions. The enhanced paste
stability created through its novel formulation strategy, increases both
field application yields and on-line paste utilization.
LOCTITE GC 10 also shows excellent solderability when reflowed in
both air and nitrogen across a wide range of challenging surface
finishes and component metallizations including immersion Ag,
OSP-Cu, ENIG and CuNiZn. It supports excellent reflow to overcome
industry wide HiP and NWO challenges. The new flux chemistry will
protect the solder longer, improve coalescence and optimize wetting
performance, allowing for very shiny solder joints.
LOCTITE GC 10 is suitable for use with industry standard SAC alloys.
FEATURES AND BENEFITS
● Halogen-free flux: passes IC with pretreatment IPC-TM-650
2.3.34/EN14582
● Halogen-free flux classification: ROL0 to ANSI/J-STD-004 Rev.
B
● Printing: Fine pitch capability (0.3 mm), stencil life (>16 hours),
and abandon time (>8 hours)
● Improved paste transfer efficiency
● Printing: Suitable for high speed printing up to 125 mms-1
● Improved reflow process window (high soak temperatures and
time) with superior coalescence and wetting
● Very shiny Pb-free solder joints over wide range of reflow
● Colorless residues for easy post-reflow inspection
● Residues pint-testable after 5x reflow
● Will allow online paste utilization protocols to be re-written
TYPICAL PROPERTIES
Based on type 4 powder.
Solder Paste Typical Properties
DIRECTIONS FOR USE
Printing:
1. LOCTITE GC 10 is available for stencil printing with type Type 4
powder.
2. Printing at speeds between 25 to 125 mms-1 can be achieved
using laser cut, electropolished or electroformed stencils with
metal squeegees.
Reflow:
1. Any of the available methods of heating to cause reflow may be
used including IR, convection, hot belt, vapor phase and laser
soldering.
2. Typical profiles that have shown good performance are shown
below.
Reflow Profile
Cleaning:
1. LOCTITE GC 10 solder pastes are no-clean and are designed to
be left on the PCB in many applications post assembly since it
does not pose a hazard to long term reliability.
2. Should there be a specific requirement for residue removal, this
may be achieved by using conventional cleaning processes
based on solvents such as LOCTITE MCF800.
3. For stencil cleaning and cleaning board misprints, LOCTITE SC-
01 Solvent cleaner is recommended.
4. Residues are easily removed in batch and in-line aqueous
cleaners even up to three days post reflow.
5. Cleaning of some assemblies is best conducted in an ultrasonic
bath.
6. Tap water is not recommended for rinsing, since ionic impurities
present in tap water can lead to reduced reliability of the
assembly.
RELIABILITY PROPERTIES
Solder Paste Medium:
LOCTITE GC 10 medium contains a stable resin system, slow
evaporating solvents and with minimal odour. The formulation has
been tested to the requirements of the ANSI/J-STD-004B for a type
ROL0 classification specifications.
PACKAGING
LOCTITE GC 10 is available in both jars and in semco cartridges, other
types of packaging may be available on request.
Storage:
Optimal storage :5 to 25ºC
Storage information may be indicated on the product container
labelling. Material removed from containers may be contaminated
during use. Do not return products to the original container. Henkel
Corporation cannot assume responsibility for product which has been
contaminated or stored under conditions other than those previously
indicated. If additional information is required, please contact your
local Technical Service Centre or Customer Service Representative.
Shelf Life:
Provided that LOCTITE GC 10 is stored in the original container, a
minimum shelf life of 365 days at 5 to 25˚C or 31 days at 40°C can
be expected.
Air shipment is recommended to minimise the time the containers are
exposed to higher temperatures.
DATA RANGES
The data contained herein may be reported as a typical value and/or a
range. Values are based on actual test data and are verified on a
periodic basis.
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Not for Product Specifications
The technical information contained herein is intended for reference
only. Please contact Henkel Technologies Technical Service for
assistance and recommendations on specifications for this product.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
μm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing, Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits. The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are trademarks of
Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark
registered in the U.S. Patent and Trademark Office.
Reference N/A
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